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This Document covers requirements for phosphine used in the semiconductor industry
orgで入手可能となる。初版は1989年発行。前版は2003年3月発行。
The purpose of this Document is to provide a guide for a grade of boron tribromide for which a need has been identified
The purpose of this Document is to provide specification for hexafluoroethane (C2F6) that is used in the semiconductor industry
This test is optional and may be omitted based on the objective of the testing
3D01300 - SEMI 3D13 - Guide for Measuring Voids in Bonded Wafer Stacks StdVol-Gases This Document covers requirements forThis Guide will assist users in selection and use of bond void metrology equipment and a protocol for performing bond void measurements based on their application. New bonding processes and applications are sensitive to significantly smaller voids than bonding processes currently used for 3DS IC package sealing. This Guide is based on experimental data on 300 mm diameter silicon wafer pairs. The inspection and metrology tools covered include only