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SEMI M1-1014 (technical revision)
may interfere with plating or solder dip finishing operations
1-0303 (technical revision)
electrical
SEMI E158 — Specification For Mechanical Features of Fab Wafer Carrier Used To Transport and Store 450 mm Wafers (450 FOUP) and Kinematic Coupling
G08800 - SEMI G88 - Specification for Tape Frame for 450 mm Wafer Revision:SEMI G88-0211 (Reapproved 0217) - Inactive SEMI M1-1014 (technical revision)The purpose of this Document is to standardize the specifications for 450 mm wafer tape frames used between the dicing process and the die bonding process, and also used for shipping and handling. This Standard is applicable to 450 mm wafer tape frames. This Standard documents the dimensions, characteristics, and measurement methods for 450 mm wafer tape frames. This Standard can be used as the specification sheet for tape frame upon purchasing.